Global Advanced Semiconductor Packaging Market to reach USD 72.5 Bn by 2031, with an Estimated CAGR of 8%, states TNR

A combination of techniques and technologies used in the semiconductor and electronics industries to package and assemble integrated circuits (ICs) or microchips is referred to as “advanced packaging.” Packaging is an important stage in the manufacturing of electronic devices because it protects the integrated circuits and provides electrical connections to the outside world. Advanced packaging technologies attempt to improve electronic component performance, functionality, and miniaturization.

Global Advanced Semiconductor Packaging Market Revenue & Forecast, (US$ Million), 2015 – 2031

Growth Drivers of the Global Advanced Semiconductor Packaging Market

Advanced packaging is assisting in meeting the need for semiconductors that power new applications such as 5G, driverless cars and other Internet of Things technologies, as well as virtual and augmented reality. These applications need high-performance, low-power CPUs capable of swiftly processing enormous amounts of data.

Advances in chip manufacturing technology are stagnating, and the economically possible maximum size of a die, and hence its performance, are becoming increasingly constrained. Back-end technology techniques that mix many CPUs provide a possible option. Advanced packaging techniques developed during the last two decades, such as 2.5-D, 3-D, fan-out, and system-on-a-chip (SoC) packaging, promises to fill the gap by augmenting wire-bonding and flip-chip technologies. As advanced packaging represents a higher-value potential than standard back-end packaging, large firms and startups alike are developing and commercialising various types of the technology in order to gain premium consumers.

2.5D and 3D technologies are gaining traction in the market. This technology has effectively given ground-breaking solutions that have aided in the introduction of sophisticated ASIC goods to the market. The 2.5D Packaging refers to the arrangement of numerous silicon chips within the same container. This approach has been employed in rugged situations where high-speed performance and low power consumption are critical.

Report Coverage and Deliverables: 

The advanced semiconductor packaging market for System-In-Package modules has grown substantially in recent years, and it is currently one of the semiconductor industry’s fastest-growing packaging technologies due to its cheaper cost, smaller form factor, better degrees of integration, and superior electrical performance. Users mostly utilise this module for wireless communication applications such as cellular phone RF sections and wireless connection. Although the great majority of modules used in high-volume SiP manufacture are double-sided, the next generation of applications, notably mobile phones, will utilize four-layer or high-density connection. These modules are capable of meeting tiny form factor requirements, but at a substantially greater cost than prior generations.

While conventional packaging’s poor margins, along with high labor and construction costs in the US, have hampered domestic investment in traditional packaging, advanced packaging presents a compelling potential for the US to increase domestic packaging capacity. Because advanced packaging has larger profit margins, large-scale advanced packaging is economically viable in the United States. Furthermore, greater automation in sophisticated packaging decreases the labor component, making it less reliant on low-cost labor and more appealing for investment in the US. All these factors are pushing the demand of advanced semiconductor packaging market.

Competitive Landscape

The global advanced semiconductor packaging market’s competitive landscape is dynamic and featured several key players. The study also recognizes and analyses key business tactics used by these leading market actors, such as mergers and acquisitions (M&A), affiliations, partnerships, and contracts. Market participants are continually investing in research and development to stay competitive in the rapidly evolving advanced semiconductor packaging market.

Key competitors in the global advanced semiconductor packaging market are

• Amkor Technology
• ASE
• AT&S
• Chipbond Co., Ltd.
• ChipMOS TECHNOLOGIES INC.
• Intel Corporation
• Jiangsu Changdian Technology Co., Ltd. (JCET Global)
• Powertech Technology Inc
• Samsung
• SHINKO ELECTRIC INDUSTRIES CO., LTD.
• Taiwan Semiconductor Manufacturing Company, Limited.
• Unimicron
• Other market participants

Global Advanced Semiconductor Packaging Market Report Coverage

Global Advanced Semiconductor Packaging Market

By Type

• Wafer Level
  • Fan In
  • Fan Out
• 2.5D Stacking
• 3-D Stacking
• Chip Scale Packages
• Embedded Die Substrate
• System-in-package
• MEMS and Micro-System Packaging
• Others

By End User Industry

• Healthcare
• Automotive
• Aerospace
• Defense
• Consumer Electronics
• IT and Telecommunication
• Others

By Region

• North America (U.S., Canada, Mexico, Rest of North America)
• Europe (France, The UK, Spain, Germany, Italy, Nordic Countries (Denmark, Finland, Iceland, Sweden, Norway), Benelux Union (Belgium, The Netherlands, Luxembourg), Rest of Europe)
• Asia Pacific (China, Japan, India, New Zealand, Australia, South Korea, Southeast Asia (Indonesia, Thailand, Malaysia, Singapore, Rest of Southeast Asia), Rest of Asia Pacific)
• Middle East & Africa (Saudi Arabia, UAE, Egypt, Kuwait, South Africa, Rest of Middle East & Africa)
• Latin America (Brazil, Argentina, Rest of Latin America)

Table of Contents

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Key Findings

Note: This ToC is tentative and can be changed according to the research study conducted during the course of report completion.

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**Exclusive for Multi-User and Enterprise User.

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Global Advanced Semiconductor Packaging Market Segmentation

By Type

By End User Industry

By Region

**Note: The report covers cross-segmentation analysis by region further into countries

The Niche Research approach encompasses both primary and secondary research methods to provide comprehensive insights. While primary research is the cornerstone of our studies, we also incorporate secondary research sources such as company annual reports, premium industry databases, press releases, industry journals, and white papers.

Within our primary research, we actively engage with various industry stakeholders, conducting paid interviews and surveys. Our meticulous analysis extends to every market participant in major countries, allowing us to thoroughly examine their portfolios, calculate market shares, and segment revenues.

Our data collection primarily focuses on individual countries within our research scope, enabling us to estimate regional market sizes. Typically, we employ a bottom-up approach, meticulously tracking trends in different countries. We analyze growth drivers, constraints, technological innovations, and opportunities for each country, ultimately arriving at regional figures.Our process begins by examining the growth prospects of each country. Building upon these insights, we project growth and trends for the entire region. Finally, we utilize our proprietary model to refine estimations and forecasts.

Our data validation standards are integral to ensuring the reliability and accuracy of our research findings. Here’s a breakdown of our data validation processes and the stakeholders we engage with during our primary research:

• Supply Side Analysis: We initiate a supply side analysis by directly contacting market participants, through telephonic interviews and questionnaires containing both open-ended and close-ended questions. We gather information on their portfolios, segment revenues, developments, and growth strategies.
• Demand Side Analysis: To gain insights into adoption trends and consumer preferences, we reach out to target customers and users (non-vendors). This information forms a vital part of the qualitative analysis section of our reports, covering market dynamics, adoption trends, consumer behavior, spending patterns, and other related aspects.
• Consultant Insights: We tap into the expertise of our partner consultants from around the world to obtain their unique viewpoints and perspectives. Their insights contribute to a well-rounded understanding of the markets under investigation.
• In-House Validation: To ensure data accuracy and reliability, we conduct cross-validation of data points and information through our in-house team of consultants and utilize advanced data modeling tools for thorough verification.

The forecasts we provide are based on a comprehensive assessment of various factors, including:

• Market Trends and Past Performance (Last Five Years): We accurately analyze market trends and performance data from preceding five years to identify historical patterns and understand the market’s evolution.
• Historical Performance and Growth of Market Participants: We assess the historical performance and growth trajectories of key market participants. This analysis provides insights into the competitive landscape and individual company strategies.
• Market Determinants Impact Analysis (Next Eight Years): We conduct a rigorous analysis of the factors that are projected to influence the market over the next eight years. This includes assessing both internal and external determinants that can shape market dynamics.
• Drivers and Challenges for the Forecast Period:Identify the factors expected to drive market growth during the forecast period, as well as the challenges that the industry may face. This analysis aids in deriving an accurate growth rate projection.
• New Acquisitions, Collaborations, or Partnerships: We keep a close watch on any new acquisitions, collaborations, or partnerships within the industry. These developments can have a significant impact on market dynamics and competitiveness.
• Macro and Micro Factors Analysis:A thorough examination of both macro-level factors (e.g., economic trends, regulatory changes) and micro-level factors (e.g., technological advancements, consumer preferences) that may influence the market during the forecast period.
• End-User Sentiment Analysis: To understand the market from the end-user perspective, we conduct sentiment analysis. This involves assessing the sentiment, preferences, and feedback of the end-users, which can provide valuable insights into market trends.
• Perspective of Primary Participants: Insights gathered directly from primary research participants play a crucial role in shaping our forecasts. Their perspectives and experiences provide valuable qualitative data.
• Year-on-Year Growth Trend: We utilize a year-on-year growth trend based on historical market growth and expected future trends. This helps in formulating our growth projections, aligning them with the market’s historical performance.

Research process adopted by TNR involves multiple stages, including data collection, validation, quality checks, and presentation. It’s crucial that the data and information we provide add value to your existing market understanding and expertise. We have also established partnerships with business consulting, research, and survey organizations across regions and globally to collaborate on regional analysis and data validation, ensuring the highest level of accuracy and reliability in our reports.